redmi pad se 8.7 4g - Hong Kong

Release

Released 2024, August 8

OS

Android 14, HyperOS

Technology

GSM / HSPA / LTE

SIM

Dual SIM (Nano-SIM, dual stand-by)

Display

Screen Size

8.7 inches

Type

IPS LCD, 1B colors, 90Hz, 600 nits (HBM)

Resolutions

800 x 1340 pixels

Protection

Corning Gorilla Glass 3

Camera

Rear Single

8 MP, f/2.0, (wide), 1/4.0", 1.12µm

Flashlight

LED flash

Features

HDR
1080p@30fps

Selfie

5 MP, f/2.2, (wide), 1/5.0", 1.12µm

Face Unlock

Yes

Internals

GPU

Mali-G52 MC2

CPU

Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55)

Chipset 

Mediatek Helio G85 (12 nm)

Memory

RAM

4GB 

Storage

64GB / 128GB 

Card Slot

microSDXC (dedicated slot)

Battery

Capacity

6650 mAh

Type

N/A

Removable

No

Fast Charge

10W Fast Charging

Wireless Charge

No

Body

Colors

Forest Green, Ocean Blue, Urban Grey

Material

Glass front (Gorilla Glass 3)

Dimensions

211.6 x 125.5 x 8.8 mm (8.33 x 4.94 x 0.35 in)

Weight

370 g

Water Proof

IP53, dust and splash resistant

Networks

4G

1, 2, 3, 4, 5, 7, 8, 13, 18, 19, 20, 26, 28, 38, 40, 41, 66

3G

HSDPA 800 / 850 / 900 / 1700(AWS) / 1900 / 2100

2G

GSM 850 / 900 / 1800 / 1900

Speed

HSPA, LTE

Connectivity

GPS

GPS, GALILEO, GLONASS, BDS

Radio

No

USB

2.0, Type-C 

Bluetooth

5.3, A2DP, LE

Wi-Fi

Wi-Fi 802.11 a/b/g/n/ac, dual-band

NFC

No

Others

Audio jack

Yes

Sensors

Accelerometer, proximity (accessories only), compass
Virtual proximity sensing